徐 涛 (Xu Tao)  |男；汉族；1993.08；籍贯：江西九江

联系方式：18270911948；微信：18270911948；E-mail: xutaoaug@qq.com

研究方向：金属材料连接

研究成果

1)  Xu Tao, Shi Y , Jiang Z , et al. Improvement of cryogenic toughness for 9% Ni steel keyhole TIG butt-welded joints with a Ni interlayer[J]. Materials Science and Engineering: A, 2022, 835:142661. 

2)  Xu Tao, Shi Y, Jiang Z, et al. An extraordinary improvement in cryogenic toughness of K-TIG welded 9Ni steel joint assisted by alternating axial magnetic field[J]. Journal of Materials Research and Technology, 2023,25:3071-3077.

3)  Hu X , Xu T , Keer L M , et al. Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates[J]. Journal of Alloys and Compounds, 2017, 690:720-729. 

4)  Hu X , Xu T , Keer L M , et al. Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints[J]. Materials Science and Engineering: A, 2016, 673:167-177. 

5)  Tao Xu, Yonghua Shi, Zhuoyong Liang. Effects of Magnetic Fields in Arc Welding, Laser Welding and Resistance Spot Welding: A Review[J], Advanced Engineering Materials, 2023,25(5): 2200682. 

6)  Xu T , Hu X , Li Y , et al. The growth behavior of interfacial intermetallic compound between Sn-3.5Ag-0.5Cu solder and Cu substrate under different thermal-aged conditions[J]. Journal of Materials Science: Materials in Electronics, 2017, 28:18515-18528. 

7)  Xu T , Hu X , Li J , et al. Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging[J]. Journal of Materials Science: Materials in Electronics, 2020, 31:3876–3889. 

8)  Hu X , Xu T , Jiang X , et al. Interfacial reaction and IMCs growth behavior of Sn3Ag0.5Cu/Ni solder bump during aging at various temperatures[J]. Journal of Materials Science: Materials in Electronics, 2016, 27(5):4245-4252. 

9)  Hu X , Xu T , Jiang X , et al. Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate[J]. Applied Physics A-Materials science & processing, 2016, 122(4):278.

10)  Tao Xu, Xiaowu Hu, Yulong Li, et al. Significant Inhibition of IMCs Growth between an Electroless Ni-W-P Metallization and SAC305 Solder During Soldering and Aging[J]. Journal of Wuhan University of Technology-Materials science edition, 2019, 34(01):169-179.

11)  Tao Xu, M. B. Zhou, Z. J. Zhang, et al. “Solder size effect on interfacial reaction and growth behavior of Cu–Sn intermetallic compounds in cross-scale Sn3.0Ag0.5Cu/Cu joints between stacking TSV chips during step-reflow processes”[C], ICEPT2019, IEEE, Hong Kong. DOI: 10.1109/ICEPT47577.2019.245329. 

12) 徐涛, 胡小武, 江雄心. 基板稀土微合金化对Sn3Ag0.5Cu/Cu钎焊界面反应的影响[J]. 电子元件与材料, 2016, 35(2):65-69. DOI: 10.14106/j.cnki.1001-2028.2016.02.016. 

 授权国家发明专利2项：

1) 胡小武,徐涛,万永强等. 一种抑制无铅焊点界面化合物生长的基板双镀层制备工艺[P]. 江西省：CN106480454B,2018-12-07. 第二发明人（导师第一）。授权日期：2018.12

2) 石永华,陈悦寒,王子顺,徐涛. 一种锁孔效应钨极氩弧焊接保护尾罩[P]. 广东省：CN114346388B,2023-01-06. 第四位。授权日期：2023-01