1) Huang HZ*, Huang ZF, Shuai GW, Liu Y, Yu XY, The role of indium in the microstructure and mechanical property of Sn-6.5Zn-0.08S solder, Journal of Materials Science: Materials in Electronics, 2025, 36(4): 251-266.

2) Huang HZ*, Chen WP, Shuai GW, Liu Y, Huang ZF, Corrosion characterizations of Sn-9Zn-xS in acidic and alkaline solutions, Journal of Materials Science: Materials in Electronics, 2024, 35(5): 364.

3) Yu XY, Huang HZ*, Zhang QH, Chen WP, Shuai GW. Corrosion behaviour of Sn-9Zn-xS solders in 3.5 wt.% NaCl solution, Materials Science and Technology, 2023, 39(9): 1090-1099.

4) Li Lingmei, Huang Huizhen*, Zhang Qinghuan, Shuai Gewang, Effect of P on the Properties of Sn-9Zn-0.1S Lead-Free Solder, Chinese Journal of Materials Research, 2021, 35(8): 615-622.

5) Huang HZ*, Zhang QH, Shuai GW, Yu XY, Tian TF, On the advantages of Bi addition into Sn-Cu-S lead-free solder，Materials Science and Technology, 2021, 37(18):1435-1444.

6) Huang HZ, Sha XF, Cui Y, Sun SY, Huang HY, He ZY, Liu MY, Zhou NG, Zhang XY, Wei Y, Highly efficient removal of iodine ions using MXene-PDA-Ag2Ox composites synthesized by mussel-inspired chemistry, Journal of Colloid and interface science, 2020, 567:190-201.

7) Huang Huizhen, Huang Zhufa, Liu Yang, Chen Weipeng, A Lead-Free Solder Alloy and Its Brazing Method, CN202211622765.X, 2024-10-29 (Patent).